Electronics Forum: stencil aperture (Page 4 of 121)

No-clean stencil apertures

Electronics Forum | Tue Aug 24 10:58:26 EDT 1999 | James Graves

Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Conseq

stencil apertures for BGA

Electronics Forum | Fri Apr 11 05:51:20 EDT 2008 | janz

w/4t=0.8 Regards Jan

stencil apertures for BGA

Electronics Forum | Wed Apr 16 02:46:55 EDT 2008 | andrzej

Thanks Jan for hints

Re: No-clean stencil apertures

Electronics Forum | Wed Aug 25 21:51:13 EDT 1999 | Jason Tomlinson

| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons

stencil apertures for BGA

Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej

Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio

Re: No-clean stencil apertures

Electronics Forum | Wed Aug 25 19:44:35 EDT 1999 | Dave F

| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons

stencil design software

Electronics Forum | Fri May 17 14:12:17 EDT 2002 | dason_c

Not now, Valor may under develop the module for its Trilogy 5000 with the stencil aperture based on the rules which you set. Also, check with IRI stencil (Alpha), they have a s/w and based on using ODB++ file and not Gerber. Rgds.

Re: No-clean stencil apertures

Electronics Forum | Fri Aug 27 13:31:47 EDT 1999 | swsng

1.5 FATOR FOR 20MILS QFP REDUCE 2 MILS HEEL AND INCREASE 2MIL AT TOES AT SIDES -1MILS EACH. SWSNG

stencil apertures for BGA

Electronics Forum | Mon Apr 14 17:41:21 EDT 2008 | janz

Hello, That is working for us. If you have a look at the Indium or Cookson recommendation they are very similar. Just make few diffrent patterns of the BGA and find out what is workin for you. Regards Jan

Re: No-clean stencil apertures

Electronics Forum | Wed Aug 25 17:09:53 EDT 1999 | Earl Moon

| | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Co


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